It's fun to work in a company where people truly BELIEVE in what they're doing!
We're committed to bringing passion and customer focus to the business.
If you like wild growth and working with happy, enthusiastic over-achievers, you'll enjoy your career with us!
Lumentum is seeking a talented Principal Electronics Engineer to join our Taiwan Product Development team. The successful candidate will play a key role in designing, developing, and validating high-speed fiber-optic transceiver products.
Key Responsibilities:
- Participate actively in the full product development lifecycle for high-speed fiber-optic transceivers.
- Design circuit schematics and develop substrate/PCB layouts, generating associated manufacturing documentation.
- Collaborate with PCB/substrate/FPC suppliers, conducting Design for Manufacturability (DFM) reviews.
- Perform signal integrity (SI) and power integrity (PI) simulations and implement optimizations based on results.
- Conduct Engineering Validation Testing (EVT), Design Validation Testing (DVT), and failure analysis for transceiver products.
- Evaluate new electronic devices and components for potential use in future products.
Required Qualifications:
- Master's or Bachelor's degree in Electronic Engineering, Applied Physics, or a closely related discipline.
- Good command of both spoken and written English and Chinese.
- Passionate about electronic engineering, demonstrating a proactive and fast-learning attitude.
- Ability to work independently, manage priorities, and perform effectively under pressure.
- Willingness to collaborate within a multi-cultural and multi-national team environment.
- Must be willing and able to travel occasionally to Mainland China and potentially overseas for technical support and supplier collaboration.
Knowledge:
- Comprehensive understanding of the circuit schematic design and PCB layout workflow.
- Proficiency in RF/high-speed and power layout strategies for multi-layer boards.
- Familiarity with serial communication protocols (e.g., I2C, SPI, UART, MDIO) for MCU-peripheral interfacing.
- Deep understanding of High-Density Interconnect (HDI), Semi-Additive Process (SAP) and modified Semi-Additive Process (mSAP) manufacturing techniques for PCBs, substrates, and FPCs.
Solid Experience In:
- Designing electronic circuit schematics and performing PCB layouts for products incorporating analog/mixed-signal, power management, and MCU control circuits.
- Preparing comprehensive manufacturing documentation including PCB files, Bill of Materials (BOM), and PCBA assembly instructions.
- Conducting technical DFM discussions and reviews with PCB suppliers.
- Selecting electronic components based on product reliability requirements and specifications.
- Hands-on hardware validation, debugging, and root cause failure analysis.
- Performing circuit simulation, including power integrity and signal integrity analysis.
Essential Skills:
- Proficiency with EDA tools: Cadence OrCAD and Allegro.
- Experience with CAD software: Autodesk AutoCAD.
- Ability to import and handle 3D CAD models within the PCB design process.
- Competence with simulation tools: LTspice, ANSYS HFSS, ANSYS SIwave, Keysight ADS (or equivalent).
- Skilled in using electronic loads, power probes, and oscilloscopes for power and ripple measurements.
- Skilled in using oscilloscopes and multimeters to evaluate mixed-signal circuits (ADC, DAC, IDAC, TEC drivers, etc.)
We are an equal opportunity employer and value diversity at our company.
We do not discriminate on the basis of race, religion, color, national origin, sex, gender, gender expression, sexual orientation, age, marital status, veteran status, or disability status.
We will ensure that individuals with disabilities are provided reasonable accommodation to participate in the job application or interview process, to perform essential job functions, and to receive other benefits and privileges of employment.
Please contact us to request accommodation.
