Own the physical layout of the advanced packages our AI accelerator silicon ships in. You'll take multi-die 2.5D and 3D packages from bump map through tapeout release — defining substrate and interposer stackups, planning bump and ball maps against the die floorplan, routing high-density escape and HBM-class channels, and building the power delivery that feeds hundreds of amps into the accelerator. You'll sit between the die and the board, co-designing with physical design on one side and PCB layout on the other, and you'll own the design release our substrate suppliers and OSATs build from. When the package is the thing standing between silicon and a working system, this is the role that closes it.
Full compensation packages are based on candidate experience and relevant certifications.
Final offers depend on level, location, and skills relevant to the role. Additional compensation: equity grant per company guidelines; medical / dental / vision; 401(k); standard PTO.
DensityAI sponsors qualified candidates for H-1B, O-1, TN, E-3, and other employment-based visas, and we welcome applicants on F-1 OPT and STEM-OPT. Work authorization is required at start; we provide immigration support to secure or transfer status.
Aspects of this role may involve access to information subject to U.S. export controls (EAR/ITAR). We may discuss licensing or scope adjustments during the interview.
DensityAI is an Equal Opportunity Employer. We do not discriminate on the basis of race, color, religious creed, national origin, ancestry, physical or mental disability, medical condition, genetic information, marital status, sex, gender, gender identity, gender expression, age (40+), sexual orientation, military or veteran status, pregnancy, or any other status protected by law. We comply with the California CROWN Act and provide reasonable accommodations on request.
Job details are sourced from the employer's original posting.
Open job postingAbout the company
DensityAI is a technology company building AI-related products and services.