Own the board-level physical design that turns our accelerator silicon into systems. You'll take high-speed, high-power designs from placement through fabrication release — defining stackups, escaping large fine-pitch BGAs, routing multi-hundred-amp power delivery, and holding the constraint discipline that lets a channel close margin in the lab and not just in simulation. You'll work at the seam where the package meets the system, partnering with signal and power integrity, packaging, and hardware systems, and directly with the fabrication and assembly partners who build what you release. When a board comes back and something doesn't behave, you're one of the people who knows why.
Full compensation packages are based on candidate experience and relevant certifications.
Final offers depend on level, location, and skills relevant to the role. Additional compensation: equity grant per company guidelines; medical / dental / vision; 401(k); standard PTO.
DensityAI sponsors qualified candidates for H-1B, O-1, TN, E-3, and other employment-based visas, and we welcome applicants on F-1 OPT and STEM-OPT. Work authorization is required at start; we provide immigration support to secure or transfer status.
Aspects of this role may involve access to information subject to U.S. export controls (EAR/ITAR). We may discuss licensing or scope adjustments during the interview.
DensityAI is an Equal Opportunity Employer. We do not discriminate on the basis of race, color, religious creed, national origin, ancestry, physical or mental disability, medical condition, genetic information, marital status, sex, gender, gender identity, gender expression, age (40+), sexual orientation, military or veteran status, pregnancy, or any other status protected by law. We comply with the California CROWN Act and provide reasonable accommodations on request.
Job details are sourced from the employer's original posting.
Open job postingAbout the company
DensityAI is a technology company building AI-related products and services.