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XIn most instances, this position requires in-person interviews as part of the hiring process.Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Haifa, Israel; Tel Aviv, Israel.Minimum qualifications:
- Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
- 10 years of experience in Signal Integrity (SI), Power Integrity (PI), or high-speed hardware packaging.
- Experience in electrical channel modeling, jitter budgeting, and return loss/crosstalk optimization for high-speed serial or parallel interfaces (e.g., PCIe Gen5/6, SerDes PAM4, DDR5, or Die-to-Die interconnects).
- Experience with lab measurement equipment, including multi-port Vector Network Analyzers (VNA), Time-Domain Reflectometry (TDR), and high-bandwidth real-time oscilloscopes for simulation correlation.
Preferred qualifications:
- Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.
- Experience leading SI/PI technical architecture for server-class CPUs, high-performance AI accelerators (TPUs/GPUs), or multi-chiplet modules (MCM).
- Experience developing automated EM extraction, layout parsing, and high-throughput statistical eye/BER margin analysis pipelines using Python, MATLAB, or Tcl.
- Ability to lead cross-functional technical teams, mentor engineers, and drive technical roadmaps with external OSATs, substrate manufacturers, and foundries.
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Google's mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of Google AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.
Responsibilities
- Lead end-to-end signal integrity definition, channel budgeting, and stackup optimization for complex multi-die packages, including 2.5D (CoWoS, EMIB, InFO), 3D vertical stacking, and high-density organic substrates.
- Architect and optimize multi-terabit interconnects across Die-to-Die (UCIe/BoW), host links (PCIe Gen6/7, PAM4/# SerDes), and memory subsystems (HBM3/4, DDR5, LPDDR6) in close collaboration with PHY and silicon design teams.
- Build high-accuracy 3D full-wave electromagnetic models (HFSS) for micro-bumps, C4 bumps, TSVs, interposers, and BGA transitions, establishing automated flows for statistical eye/BER margin analysis.
- Define high-frequency test vehicles, fixtures, and measurement methodologies; execute multi-port VNA, TDR, and real-time scope characterizations to correlate lab measurements with predictive simulations.
- Collaborate closely with Silicon Design, Package Layout, Board/System, and external foundry/OSAT partners to resolve design trade-offs
