At Lumilens, we are building the essential photonics infrastructure that will drive tomorrow’s AI supercomputing. From chip-to-chip optical interconnects to scalable photonic engines, Lumilens is ushering in a new era of computing that is faster, cooler, and dramatically more efficient. We’re a well-funded startup backed by Mayfield and led by veterans who have built and scaled some of the industry’s most transformative technologies.
We are seeking hands-on Process Engineers to support our volume manufacturing ramp-up at our Bulim facility. In this role, you will be responsible for process development, qualification, yield optimization, and continuous improvement across microelectronics packaging, optical module assembly, and high-precision automation lines.
We are hiring across multiple domain specializations:
Die Attach (DB / Die Bond)
Wire Bond (WB)
Active Alignment (AA / Optical Alignment)
Process Engineering – Overall / Integration
Key Responsibilities
Process Setup & Optimization: Establish robust process windows, parameter recipes, and standard operating procedures (SOPs) for assigned production modules (DB, WB, AA, or End-to-End Line Integration).
Yield & Defect Reduction: Monitor line yield metrics, lead 8D root-cause failure analysis (FA), and implement corrective actions for recurring process/equipment defects.
NPI to Mass Production: Partner with NPI and Equipment Engineering to qualify new tooling, materials (epoxies, substrates, bonding wire), and automation platforms for high-volume ramp.
Statistical Process Control: Apply SPC, DOE, FMEA, and Cpk analysis to drive process stability, cycle time reduction, and cost-efficiency initiatives.
Cross-Functional Collaboration: Work closely with Manufacturing Operators, Quality Engineers, and Maintenance Technicians to resolve line stops and uphold quality standards.
Qualifications & Requirements
Education: Bachelor’s Degree or Diploma in Mechanical, Electrical/Electronic, Mechatronics, Materials Science, or Manufacturing Engineering.
Experience: 2+ years of relevant process engineering experience in semiconductor packaging, microelectronics, surface-mount technology (SMT), or camera/optical module manufacturing.
Domain Expertise (one or more of the following):
Die Bond (DB): Experience with epoxy/eutectic dispense, high-precision pick-and-place, and flip-chip bonding.
Wire Bond (WB): Experience with ball/wedge wire bonders (gold/copper/aluminum wire) and bond pull/shear testing.
Active Alignment (AA): Experience with multi-axis optical alignment, collimation, laser/lens positioning, and UV cure dispensing.
Overall Process: Strong background in line balancing, end-to-end yield tracking, DOE, and cleanroom protocols.
Technical Skills: Proficiency in SPC tools (JMP, Minitab), GD&T, and structured problem-solving methodologies (8D, 5-Why, Fishbone).
Work Arrangement: Willingness to work on-site at the Bulim plant and support operational needs during ramp-up phases.
Competitive salary and benefits
Opportunities for career advancement
Work with a world-class team solving cutting-edge challenges
Collaborative and innovative work environment
Lumilens is committed to building a diverse and inclusive workplace. We are proud to be an equal opportunity employer.
Job details are sourced from the employer's original posting.
Open job postingAbout the company
Lumilens is building the critical photonics infrastructure that powers tomorrow’s AI supercomputing. From chip-to-chip optical interconnects to scalable photonic engines, Lumilens is unlocking a new era of computing faster, cooler, and massively more efficient.