About Lyte
Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit www.lyte.ai
If you’re excited about building impactful technology in a dynamic, hands-on environment, we’d love to hear from you!
About the role
- We are seeking an experienced engineering lead in device packaging, module mechanical assembly, PCBA and device test engineering leader with degree in Electrical Engineering, Photonics, Mechanical Engineer, or a related field.
What you'll do
- Lead Asia operation team working with OSATs, assembly houses, PCBA lines to support NPI and volume production.
- Working closely with HQ RnD and operation team to implement wafer level probe tests at OSATs to identify known good dies.
- Working with HQ team to support device packaging process improvement with Cp and Cpk increase.
- Work with HQ teams and our IIIV foundries to support wafer level process, bar level, and CoC process as well as CoC level test and qualification before and after burnin.
- Work with HQ teams and our assembly houses to support module assembly and PCBA for NPI and volume production.
- Work with reliability engineers to implement the tests needed for wafer, devices, packaged devices, and system reliability tests.
- Write technical documentation for test implementation, reports, and present results to internal and external stakeholders.
- Intime make technical and project decision.
- Participate in the process FMEA, process FA, and push to get 8D reports from contract manufactures
- Manage and expand the Asia operation team when needed.
Required Qualifications
- Minimal requirement is a bachelor's degree with 12 years of experience.
- Device test knowledge and experience for at least some following areas for: IIIV CoC, wafer level probe test, packaged electro-optical devices, assembly modules, PCBA.
- Knowledge and experience in at least some following processes: IIIV or CMOS wafer level process; IIIV bar level processes; device packaging processes such as die attach, flip chip, wire bonding, and module mechanical assembly processes, particularly camera and lidar module assembly.
- A fast learner is a must.
- Good work ethics and maintaining the company’s confidential information are a must.
Preferred Qualifications
- A higher degree with more experience is highly desired.
- Experience on optoelectronic device tests such as those for optical engines in pluggable modes and pluggable modules is a plus.
- Experience and knowledge of silicon photonic devices and IIIV CoC reliability is a huge plus.
- Experience of the setup and implementation of tests for NPI and volume production is a big plus.
- Experience in the process of automation and test automation is a plus.
- Data analysis experience such as JMPs is a plus;
Benefits (subject to location and local regulations)
- Competitive salary and equity
- Comprehensive medical, dental, and vision coverage
- 401(k) retirement plan
- Flexible vacation and time-off policy
- Collaborative, fast-paced, and inclusive work environment
- Opportunity to work on cutting-edge technologies with a highly cross-functional team
