Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit www.lyte.ai
If you’re excited about building impactful technology in a dynamic, hands-on environment, we’d love to hear from you!
About the role
- We are seeking a middle to senior level packaging design and signal/power integrity Engineer with degree in Electrical Engineering, or a related field.
What you'll do
- Own the design and layout of our micro-electronic package, the heart of our LyteCore system
- Collaborate with multi-disciplinary team of engineers (silicon, photonics, system, operations) to define physical and electrical performance specifications for the package
- Perform signal/power integrity simulation to optimize our package & system performance
- Work with our substrate/package vendors to ensure design for manufacturability and support delivery of our design on time. Work with said vendors to define high volume price target.
- Project tracking weekly.
- Write technical reports and present results.
- Maintain EDA tools and actively project future needs, including improving design flow definition and recommending EDA envelope.
Required Qualifications
- Minimal requirement is a bachelor's degree with 5 years of experience
- Fluent in English communication, able to collaborate with teammates in different time zones
- Experience in substrate design and packaging technology
- Experience in signal and power integration simulation and interpretation of the results
- Experience in EDA tools: Siwave, HFSS, APD, or similar
- Maintain company confidential information are a must
Preferred Qualifications
- Master’s degree with more experience is highly desired
- Proactive member of the multi-disciplinary team, takes ownership of technical challenges and work with others to resolve issues
- Experience with hands-on testing of electronic packages/systems.
- Knowledge and experience in at least some following processes: device packaging processes such as die attach, flip chip, wire bonding, and module mechanical assembly processes, particularly camera and lidar module assembly.
- Experience in other EDA tools such as Altium, Allegro PCB, Spectre, Hspice, Sigrity, ADS.
- Data analysis experience such as JMPs is a plus; excel is OK.
- Programming and software maintenance skills are desired eg. python, or C++
- Describe the experience and attributes of the ideal candidate
Benefits (subject to location and local regulations)
- Competitive salary and equity
- Flexible vacation and time-off policy
- Collaborative, fast-paced, and inclusive work environment
- Opportunity to work on cutting-edge technologies with a highly cross-functional team
