• Work on new product introduction and ramp-up of CMOS Image Sensors (CIS) and ASIC products from initial tape-out to mass production.
• Collaborate with design, test, reliability, and packaging teams to troubleshoot issues and support product development.
• Perform design rule checks and product validation to ensure robust product design; defining new product process criteria and GDS checks for tape-out.
• Develop comprehensive product characterization and testing plans with R&D and foundry teams to ensure products performance meets requirements.
• Ensure product roadmap success by identifying improvement opportunities through physical/electrical failure analysis, process optimization and defect reduction.
• Access pixel performance through statistical analysis of electrical and functional metrics at both wafer- and chip-level testing.
• Work with quality engineers to address customer complaints, implement corrective actions, and track improvements after solution implemented to minimize field returns.
• Collaborate with different foundries to optimize processes, including silicon, color and packaging processes, enhancing overall product performance.
• Work with testing engineers to develop, verify, and release CP and FT testing programs; perform sensors validation on manual testing board.
• Improve product yield by process and layout optimization; analyze yield data and drive improvement actions.
• Define production testing specifications, ensure product yield on target, and reduce process and test fluctuating issue for timely ramp-up.
• Ensure products meet AEC Q-100 standards and other relevant automotive specifications.
• Work with foundries to drive continuous yield enhancements, continuous improvement plans (CIP), and best-known-methods (BKM) updates throughout the product lifecycle.
• Deliver cutting-edge CIS solutions for the automotive industry.
Requirements:
Master’s degree in Electrical Engineering, Physics, Material Science or a related field.
One year’s experience in product engineering.
Experience shall include:
• Support IC-design clients in ramping up the new tape out (NTO) products, sustaining yields for high‐volume production products and improving product quality and functionality.
• Design rules checks and layout review to ensure robust product design.
• Experience in raw materials, production processes, quality control, costs, and techniques for maximizing the effective manufacture of products.
• Experience in cross-team work for joint project development; coordination with client, Fab and support teams to identify improvement opportunities and implement solutions.
• Monitor the CP and FT testing result to gate and resolve issues in mass production.
• Experience in physical failure analysis techniques, such as TEM, EDX, and OBIRCH.
Annual base salary for this role in California, US is expected to be between $156,853 - $160,000. Actual pay will be determined on a number of factors such as relevant skills and experience, and the pay of employees in the similar role.
