HireFT
Browse JobsHow it worksPricingAboutSuccess Stories
    Back to jobs
    ON

    Onsemi

    Semiconductors

    ENGR II, MANUFACTURING EQUIP; MFG

    Seremban, MalaysiaOn-SiteFull-time3–5 yrs experiencePosted 3w ago
    All Onsemi jobs

    Job description

    We are seeking an experienced and highly technical Senior Equipment Engineer to lead our front end assembly equipment team. You will be responsible for leading shift technicians, ensuring maximum equipment uptime, and performing advanced troubleshooting across our die bond, clip bond, reflow, and inspection lines. The ideal candidate must have strong hands-on engineering experience with ASM equipment and front end assembly processes.

    Responsibilities

    Technician Leadership: Lead, supervise, and mentor a team of shift technicians to ensure strict adherence to maintenance schedules and production KPIs.
    Machine Issue Follow-up: Take ownership of chronic, unresolved, or escalated machine issues handed over from previous shifts, conducting deep-dive root cause analysis for permanent resolution.
    Equipment Maintenance & Calibration: Oversee and execute corrective and preventive maintenance (PM) for die attach, clip bond, reflow, oven, and AOI equipment to minimize downtime.
    Process Optimization: Monitor Overall Equipment Effectiveness (OEE),Uptime,production time.
    Documentation: Establish, review, and update Standard Operating Procedures (SOP), troubleshooting matrices, and technical training materials for the engineering team.

    Qualifications

    Candidates must have hands-on experience in operation, setup, troubleshooting, or maintenance for the following equipment:
    Die Bonder: ASM AD838, AD8312PLUS, DA D510, ALPHASAM
    Clip Bonder: AD830CB, AD830PLUS, BESTEM-C310
    Reflow & Ovens: RO830, RO832, BOCS-6 (Reflow), PINK VADU (Vacuum Soldering System)
    Screen Printer: ASM DEK
    Cleaning Systems: CREST,
    Automated Optical Inspection (AOI): PENTAMASTER AOI
    Requirements:
    Education: Bachelor’s Degree in Mechanical, Mechatronics, Electrical, or Electronic Engineering.
    Experience: Minimum 3–5+ years of solid engineering experience in semiconductor Front assembly (Die Bond / Clip Bond line preferred).
    Technical Skills:
    Expertise in ASM die bond platforms, Solder Phasa bonding mechanisms, and vision systems.
    Proficient in engineering problem-solving tools (8D, FMEA, SPC, 5-Why, Fishbone).
    Leadership: Proven track record of managing shift technicians and driving team performance under pressure.
    Working Hours: Must be willing to support shift teams, handle escalations, and work flexible hours when required.

    About Us

    onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

    More details about our company benefits can be found here:

    https://www.onsemi.com/careers/career-benefits

    Job details are sourced from the employer's original posting.

    Open job posting
    ON

    About the company

    Onsemi

    onsemi is a leading manufacturer of semiconductor solutions.

    View all Onsemi jobs
    Industry
    Semiconductors
    Open roles
    726

    Interested in this role?

    Apply with HireFT

    Free to start — no card required.

    Your fit

    How well do you match?

    Sign in to see how your résumé lines up with this role.