Lead the development, qualification, and manufacturing release of advanced flip-chip packaging solutions, including substrate-based (FC-BGA, FC-LGA) and leadframe-based technologies. Drive package development from concept through production while working closely with Product Engineering, Silicon Design, Reliability, Operations, OSATs, and suppliers to deliver high-performance, reliable, and cost-effective products.
Responsibilities
- Lead package development activities from concept, design, qualification, and production release.
- Develop and optimize substrate-based and leadframe-based flip-chip package technologies.
- Drive package architecture, material selection, assembly process development, and manufacturability improvements.
- Support flip-chip integration, including bumping, underfill, reflow, molding, and singulation process optimization.
- Develop qualification plans and assess package reliability performance.
- Lead root-cause investigations and corrective actions for package, assembly, and reliability issues.
- Collaborate with OSATs and suppliers on process development, yield improvement, and cost reduction initiatives.
- Support NPI execution and transfer technologies into high-volume manufacturing.
Qualifications
- BS/MS in Electrical Engineering, Mechanical Engineering, Materials Science, or related field.
- 8+ years of semiconductor package development experience.
- Strong expertise in:
- Flip-chip packaging technologies
- FC-BGA and FC-LGA packages
- FC-QFN, FC-DFN, DrMOS, and SPS packages
- Leadframe and substrate packaging processes
- Package reliability and qualification
- Knowledge of DOE, DFMEA, SPC, 8D, and statistical problem-solving methodologies.
- Experience working with OSATs, substrate suppliers, and material vendors.
- Strong technical leadership and project management skills.
- Strong communication skills, with the ability to effectively collaborate with Business Units, cross-functional teams, internal and external manufacturing partners, and customers.
- Proficiency in engineering tools and methodologies, including ACAD, 8D, SPC, DFMEA, DOE.
- Proven ability to lead projects across organizations and cultures in a fast-paced environment.
About Us
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
