- Lead R&D initiatives focused on die preparation processes like but not limited to laser groove / ablation, mechanical dicing, stealth dicing.
- Collaborate with cross-functional teams to drive innovation and integrate new process technologies.
- Design and conduct experiments to develop and refine packaging processes.
- Analyze experimental data to identify trends and optimize process parameters.
- Develop comprehensive process documentation and control plans.
- Address and resolve complex process-related challenges.
- Stay abreast of the latest advancements in semiconductor packaging and incorporate cutting-edge techniques.
- Mentor and provide technical leadership to junior engineers and team members.
- Ensure all R&D activities comply with industry standards and company policies.
Qualifications
- Education
- Bachelor's or Master's degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
- Experience
- Minimum of 8 years of experience in semiconductor package assembly process development.
- Experience in Project Management is a plus.
- Skills
- In-depth knowledge of wafer singulation processes, semiconductor packaging technologies and materials.
- Proven track record in process development and efficient use of methodologies.
- Strong analytical and problem-solving skills.
- Excellent communication and collaboration abilities.
- Familiar with Project Management concepts and tools.
About Us
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
