Development of semiconductor / Optoelectronics assembly & Packaging like LEDs, Hybrid Micro circuits, Chip on boards, optoelectronics packages
Process development of die attach , wire bonding , encapsulation etc , on various substrates using eutectic , solder , conductive / non conductive epoxies etc and transition to manufacturing scale ;
To take lead in Technology /Product transfer from sister companies, NPI Engineering , BOM creation and Maintenance, proto typing & FA Approvals
To workout manufacturing cost estimates , equipment capacity requirements , production ramp up requirements
Sustaining process engineering support , training Manufacturing personnel on developed process , SPC and yield analysis.
Investigate Customer Complaints / corrective action requests , Faiure and route cause analysis and initiate corrective and preventive action measures working with other functional groups
Qualifications
10+ years hands on experience in a reputed Semiconductor / Optoelectronics manufacturing plant in assembly and packaging process development of die attach , wire bond and encapsulation .
Programming skills with automatic epoxy machines, Optical measurement systems desirable.
Working knowledge of FMEA , Six Sigma and statistical analysis using Minitab etc;
To interpretate mechanical drawings . Experience preferred to generate drawings in Solid works , Autocad drawings , Programming vision based measurement systems and process equipment.
Job details are sourced from the employer's original posting.
