<table border="0" cellpadding="4" cellspacing="0" style="margin-bottom: 20px; background-color: rgb(255, 255, 255); padding: 5px; border: 1px solid rgb(204, 204, 204); box-shadow: rgba(0, 0, 0, 0.1) 0px 2px 2px; border-radius: 5px; color: rgb(0, 0, 0); font-family: verdana; font-size: 12px; font-style: normal; font-variant-ligatures: normal; font-variant-caps: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: start; text-transform: none; white-space: normal; widows: 2; word-spacing: 0px; text-decoration-style: initial; text-decoration-color: initial; width: 100%;" width="99%"><tbody><tr><td style="color: rgb(102, 102, 102); border-bottom: 1px dotted rgb(204, 204, 204);"><div>1.
Conduct new manufacturing processes and material development for module parameter adjustment and process stability maintenance.</div><div>2. Product construct design&nbsp;and quotation.</div><div>3. Evaluate engineering equipment or tools for manufacturing processes.</div><div>4. New technology application and development.</div><div><br></div><div>1.協助製程開發導入(材料、機台、治工具的開發與優化)<br style="box-sizing: border-box; color: rgb(41, 41, 41); font-family: PingFangTC, ;">2.新產品製程導入規範,流程及操作相關文件制定(process control plan、pFMEA、SOP、MOI...)<br style="box-sizing: border-box; color: rgb(41, 41, 41); font-family: PingFangTC, ;">3.具備產品不良異常分析與改善能力<br style="box-sizing: border-box; color: rgb(41, 41, 41); font-family: PingFangTC, ;">4.具備製程參數優化、DoE工程驗證設計能力<br style="box-sizing: border-box; color: rgb(41, 41, 41); font-family: PingFangTC, ;">&nbsp;</div><div><br></div><div>Qualification:</div><div>1.
Experienced in IGBT Power Module Assembly or Power Discrete Assembly</div><div>2. Experienced in wire bonding (Ball bond: gold wire, copper wire, Wedge bond, thick aluminum wire, thick copper wire)</div><div>3. Experienced in die bonding (glue bonding, alloy bonding, and sintering)</div><div>4. Experienced in encapsulation (EMC Molding, Epoxy Potting, Silicone Potting), etc.</div><div>5.
Applicants with experience in the SMT process are preferred</div><div>6. Able to use JMP or MINITAB for statistical analysis</div><div>7. Able to use Creo or Solidworks for mechanical drafting</div><div><br></div><div>加分技能條件: (擇一即可)<br style="box-sizing: border-box; color: rgb(41, 41, 41); font-family: PingFangTC, ;">1. 具備IGBT電源模組組裝(IGBT Power Module Assembly)經驗或是離散功率零件組裝(Power Discrete Assembly)經驗<br style="box-sizing: border-box; color: rgb(41, 41, 41); font-family: PingFangTC, ;">2. 具備打線Wire bond(Ball bond: 金線、銅線, Wedge bond: 粗鋁線、粗銅線)經驗<br style="box-sizing: border-box; color: rgb(41, 41, 41); font-family: PingFangTC, ;">3. 具備著晶Die bond(膠結合、合金結合及Sintering)經驗<br style="box-sizing: border-box; color: rgb(41, 41, 41); font-family: PingFangTC, ;">4. 具備封裝Encapsulation(EMC Molding, Epoxy Potting, Silicone Potting)等經驗<br style="box-sizing: border-box; color: rgb(41, 41, 41); font-family: PingFangTC, ;">5. 具備Laser機台操作經驗&nbsp;</div><div>6. 會JMP或MINITAB統計分析<br>7. 會Creo或Solidworks機械製圖</div><div><br></div><div>#LI-JH</div><div>#LI-ERIK</div><div>#LI-ONSITE</div><div><br></div><div>Apply now: https://usiglobal.freshteam.com/jobs</div></td></tr></tbody></table>
Job details are sourced from the employer's original posting.
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USI INC is a company that provides services related to human resources and talent management.