Senior Photonics Packaging Engineer

About Xscape Photonics 

Xscape Photonics is helping customers escape the scaling limits of Agentic AI hardware by enabling machines to think faster. Spun out of groundbreaking silicon photonics work at Columbia University, the company has developed a scalable multi-color laser platform to solve the escape bandwidth bottlenecks limiting GPU-to-GPU and GPU-to-memory interfaces. With a leadership team having multiple decades of experience shipping photonics products and backed by investors including Nvidia and Cisco, the company has recently begun sampling its first technology validation kits and is currently engaged with pilot customers for its first product launch.

About the Role
We’re seeking a seasoned Photonics Packaging Engineer to lead the design,
development, and integration of advanced photonic components—specifically lasers,
PICs, and SOAs—into high-performance optoelectronic modules. This role is pivotal in
driving innovation in next-generation optical communication systems, with a strong
emphasis on precision alignment, wafer-level packaging, and packaging process
development.

Key Responsibilities

• Design and develop photonic packaging solutions for integration of lasers,
  PICs, SOAs and other optical components
• Lead optical, mechanical, and thermal co-design for high-density
  optoelectronic assemblies
• Collaborate with cross-functional teams (R&D, process, reliability, and test
  engineering) to optimize packaging architecture
• Drive active/passive alignment strategies for sub-micron precision in fiber and
  chip coupling
• Develop and validate emerging photonic interconnect technologies including
  photonic wire-bond, co-packaged optics, and fiber optical connectors
• Conduct DFM (Design for Manufacturability) and transfer of packaging
  processes to volume production
• Evaluate and qualify materials, processes, and photonics interconnects for
  photonic packaging
• Author detailed documentation including design specs, process flows, and
  test protocols

Required Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, Optical Engineering,
  Physics, or related field
• 5+ years of hands-on experience in photonics packaging, with a strong focus
  on laser, PIC, and SOA heterogeneous integration
• Deep understanding of optical coupling techniques, waveguide interfaces, and
  photonic device behavior
• Experience with cleanroom processes, micro-assembly, and fiber attach
• Strong knowledge of CAD tools (SolidWorks), optical simulation software
  (Lumerical, Zemax), and thermal modeling tools
• Excellent problem-solving skills and ability to work in a fast-paced, collaborative
  environment

Preferred Skills

• Experience with silicon photonics or InP platforms
• Familiarity with high-speed optical transceivers and telecom/datacom
  standards
• Background in automated packaging systems and precision robotics
• Knowledge of RF packaging and signal integrity considerations